Flexible tool configuration with up to 12 processing modules and 4 I/O stations
Located
• Dellach 207, 9772 Dellach im Drautal
• Friedensstraße 11, 9500 Villach
Austria – Europe
Phone
+43 4242 30848
FAX
+43 4242 30848-10
Inline Coater and Developer Cluster for High Volume Production
LS 4000 coater – and developer system for wafer sizes up to 200mm with stepper interface offers maximum throughput for high volume production in combination with flexible system configuration for various process applications.
System Features
Handling System
- 3-axis Pick & place robot
- Contactless wafer centering “on-the-fly”
- OCR, bar and matrix code support
- Edge gripping of wafers available
- Intelligent cassette slot scanning detects carrier type, wafer size and double or cross loaded slots
- FOUP load ports can be integrated
Coater Module
- Optimized bowl design with symmetric exhaust for optimal process results
- Programmable Edge Bead Removal, wafer backside and bowl rinse
- Dispense system for up to 5 different media per bowl with automatic nozzle change
- Temperature controlled dispense lines
- Range of resist pumps to choose from:
» customer-specific
» pressure tank
» stepper motor driven pump
» syringe
Developer Module
- Proven process bowl design with symmetric exhaust
- Dispense system for up to 3 different media per bowl
- Various developer media can be applied by:
» Puddle nozzle
» Fan spray nozzle
» Binary spray nozzle - Programmable top-, backside & bowl rinse
Hot- and Coolplate Module
- Up to 6 hot- or coolplates per module
- Standard hotplate (60° – 200°C)
- High-temperature hotplate (60° – 450°C)
- Hotplate with heated cover
- HMDS Priming hotplate (60° – 200°C)
- Coolplate (15° – 45°C), with either water or Peltier cooling
- Distance control via
» programmable proximity
» fixed proximity