Flexible tool configuration with up to 8 processing modules and 4 I/O stations
Located
Technologiepark Villach
Europastrasse 8
9524 Villach
Austria – Europe
Phone
+43 4242 30848
FAX
+43 4242 30848-10
Modular, flexible, expandable – one platform, many solutions
LS Series are fully automated Coater- and Developer Systems. Different, individually chosen processing modules and carriers for various substrate types and sizes may be combined on one of our three basis platforms (LS1000, LS2000, LS2500) – utmost flexibility for unique requirements.
System Features
Handling System
- 3-axis Pick & place robot
- Contactless wafer centering “on-the-fly”
- OCR, bar, and matrix code support
- Edge gripping of wafers available
- Intelligent cassette slot scanning detects carrier type, wafer size and double or cross-loaded slots
Coater Module
- Optimized bowl design with symmetric exhaust for optimal process results
- Programmable Edge Bead Removal, wafer backside and bowl rinse
- Dispense system for up to 5 different media per bowl with automatic nozzle change
- Range of resist pumps to choose from:
» customer-specific
» pressure tank
» stepper-motor driven pump
» syringe - Spin- and Spray coating
Developer Module
- Proven process bowl design with symmetric exhaust
- Dispense system for up to 5 different media per bowl with automatic nozzle change
- Various developer media can be applied by:
» Puddle nozzle
» Fan spray nozzle
» Binary spray nozzle - Programmable top-, backside & bowl rinse
Hot- and Coolplate Module
- Up to 5 hot- or coolplates per module
- Standard hotplate (60°C – 200°C)
- High-temperature hotplate (60°C – 450°C)
- HMDS Priming hotplate (60°C – 200°C)
- Coolplate (10°C – 60°C), with either water or Peltier cooling
- Distance control via
» programmable proximity
» fixed proximity
» vacuum contact