Developer, Etch- and Lift-Off Tools for Foil Processing

LS Processors for Foils and flexible Substrates

LS Processors for Foils offer maximal flexibility for process applications such as spray development, spray etching, and lift-off-processes in combination with high variability of substrates, including foils and flexible substrates (glass, ceramic, plastic, and others). Substrates are automatically loaded into the process station using a sophisticated transfer system. Further process options such as recycling and heating of process media, high-pressure applications, and others can be integrated.

LS Series for Foil Processing

System Features

  • 2-axis Handling System of automated loading of foils into the process chamber
  • Customer specific foil types and sizes up to 400mm x 400mm
  • Minimal contact area, only 5mm at edge of the foil
  • Full area vacuum holding with controlled vacuum
  • Automated chuck cleaning function
  • Safe holding of foils on chuck at high spin speeds, up to 4000rpm
  • SECS/GEM interface
  • Customer specific solutions

Handling System

  • 2-axis handling system of automated loading of foils into the process chamber
  • Customer-specific foil types and sizes up to 400×400 mm (thickness >=50µm)
  • Minimal contact area, only 5mm at the edge of the foil
  • No backside contamination during foil handling
  • Fast and safe transfer of foils to the process chamber

Special Chuck for Foils

  • Dedicated chuck design for foils
  • Customer-specific foil types and sizes up to 400mm x 400mm (thickness >=50µm)
  • Special chuck design for foils
  • Full area vacuum holding with controlled vacuum
  • Automated chuck cleaning function
  • Safe holding of foils on chuck at high spin speeds, up to 4000rpm