in manufacturing of Semiconductor Equipment – especially Coater and Developer Systems.
LS 1000 and LS 2000 Series Systems are fully automated Coater- and Developer Systems. Different, individually chosen processing modules and carriers for various substrate types and sizes may be combined on one of our basis platforms – utmost flexibility for sophisticated applications.
LS 4000 coater – and developer system for wafer sizes up to 200mm with stepper interface offers maximum throughput for high volume production in combination with flexible system configuration for various process applications.
LS 7000 Systems are available as R&D-tool with manual handling and as full automated production tools for various applications such as spray coating, puddle – or spray developing, bake processes and others. This system has the capability to process substrates with diagonals up to 1000mm.
The LS HMDS Vapor Priming System is designed for high throughput. It can process two cassettes each for 25 wafers with a size up to 200mm diameter at one run.
LS Processors for Foils and Flexible Substrates are offering maximal flexibility for process applications such as spray development, spray etching, cleaning and lift-off-processes in combination with high variability of substrates including foils and flexible substrates (glass, ceramic, plastic and others).
Based on our experience, we can provide support for process setup and optimization.
Our modular tool design enables us to configure systems for customer specific applications.
We use industrial proven standard components in our systems to ensure high reliability and low service and maintenance costs.